Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Devices and methods of forming low resistivity noble metal interconnect

Devices and methods of forming low resistivity noble metal interconnect

US Patent 10679937 · Granted Jun 9, 2020

Estimated economic value: $60,273,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electrical test of optical components via metal-insulator-semiconductor capacito2025
Device, method and system to prevent pattern collapse in a semiconductor structu2024
Optical modulator using monocrystalline and polycrystalline silicon2024
Semiconductor device having a self-forming barrier layer at via bottom2024
Precision spacing control for optical waveguides2024
Grating coupler2023
Integrate stressor with Ge photodiode using a substrate removal process2023
Electrical test of optical components via metal-insulator-semiconductor capacito2023
Optical modulator using monocrystalline and polycrystalline silicon2023
Dummy fill structures2023
Epitaxial semiconductor material regions for transistor devices and methods of f2022
Epitaxial semiconductor material regions for transistor devices and methods of f2021