Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for producing copper particles, copper particles, and copper paste

Method for producing copper particles, copper particles, and copper paste

US Patent 10625344 · Granted Apr 21, 2020

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dispersion medium for metal particle sintering, and electroconductive paste2025
Joining material, production method for joining material, and joined body2025
Bonding member, method for producing bonding member and method for producing bon2024
Method for synthesizing copper-silver alloy, method for forming conduction part,2024
Method for synthesizing copper-silver alloy, method for forming conduction part,2024
Bonding structure production method and bonding structure2024
Electrically conductive paste and sintered body2023
Method for producing an electronic device2023
Substrate evaluation chip and substrate evaluation device2022
Solder alloy for power devices and solder joint having a high current density2022
Electrically conductive paste, laminated body, and method for bonding Cu substra2022
Bonding material, method for producing bonding material, and method for producin2022