Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Solder alloy for power devices and solder joint having a high current density

Solder alloy for power devices and solder joint having a high current density

US Patent 11331759 · Granted May 17, 2022

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semifinished product for populating with components and, method for populating s2025
Dispersion medium for metal particle sintering, and electroconductive paste2025
Bonding member, method for producing bonding member and method for producing bon2024
Method for synthesizing copper-silver alloy, method for forming conduction part,2024
Method for synthesizing copper-silver alloy, method for forming conduction part,2024
Bonding structure production method and bonding structure2024
Method for producing an electronic device2023
Vibration-damped circuit arrangement, converter, and aircraft having such an arr2023
Substrate evaluation chip and substrate evaluation device2022
Method for mounting an electrical component in which a hood is used, and a hood 2022
Capacitor structure and power module having a power electronic component2022
Power module having a power electronics device on a substrate board, and power e2022