Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Mechanically improved microelectronic thermal interface structure for low die stress

Mechanically improved microelectronic thermal interface structure for low die stress

US Patent 10446466 · Granted Oct 15, 2019

Estimated economic value: $39,662,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Use of white noise in auditory devices2025
Auditory device to auditory device communication linking2025
Hearing aid listening test profiles2025
Auditory device source detection and response2025
Transmitting audio streams to auditory devices based on user preferences2025
Micropillar-enabled thermal ground plane2025
Single and multi-layer mesh structures for enhanced thermal transport2025
Method and device for optimization of vapor transport in a thermal ground plane 2024
Thermal management planes2024
Folding thermal ground plane2024
Single and multi-layer mesh structures for enhanced thermal transport2024
Die package having security features2023