Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chemical mechanical polishing pads for improved removal rate and planarization

Chemical mechanical polishing pads for improved removal rate and planarization

US Patent 10391606 · Granted Aug 27, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Chemical mechanical polishing pad2025
Chemical mechanical planarization pad having polishing layer with multi-lobed em2025
Composite pad for chemical mechanical polishing2025
Chemical mechanical polishing pad and preparation thereof2025
Conductive polymer composition2025
Polyfunctional hydrazide crosslinker2024
Electrodepositable coating composition including a phyllosilicate pigment and a 2024
Dispersions containing graphenic carbon nanoparticles and dispersant resins2024
Chemical mechanical polishing pad and preparation thereof2023
Low-debris fluopolymer composite CMP polishing pad2023
Low-debris fluopolymer composite CMP polishing pad2023
Methods of making chemical mechanical polishing layers having improved uniformit2022