Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Self-organizing barrier layer disposed between a metallization layer and a semiconductor region

Self-organizing barrier layer disposed between a metallization layer and a semiconductor region

US Patent 10332793 · Granted Jun 25, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device2025
Current measuring circuit2025
Semiconductor device including bonding pad metal layer structure2024
Semiconductor device protection using an anti-reflective layer2024
Magnetoresistive sensor and fabrication method for a magnetoresistive sensor2024
Semiconductor device including bonding pad metal layer structure2023
Electronic device, electronic module and methods for fabricating the same2023
Prognostic health management for power devices2022
Magnetoresistive sensor with reduced stress sensitivity2022
Semiconductor device power metallization layer with stress-relieving heat sink s2022
Semiconductor device power metallization layer with stress-relieving heat sink s2022
Semiconductor device and a method of forming the semiconductor device2021