Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features

Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features

US Patent 10190228 · Granted Jan 29, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of electroplating copper into a via on a substrate from an acid copper el2021
Method of electroplating copper into a via on a substrate from an acid copper el2021
Method of electroplating photoresist defined features from copper electroplating2019
Method of electroplating photoresist defined features from copper electroplating2019
Method of electroplating photoresist defined features from copper electroplating2019
Method of electroplating photoresist defined features from copper electroplating2019
Method of filling through-holes to reduce voids and other defects2019
Method of filling through-holes to reduce voids and other defects2019
Nitrogen containing polymers as levelers2019
Polymers containing benzimidazole moieties as levelers2019
Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhaloge2019
Method of electroplating photoresist defined features from copper electroplating2018