Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Aqueous formulations for removing metal hard mask and post-etch residue with Cu/W compatibility

Aqueous formulations for removing metal hard mask and post-etch residue with Cu/W compatibility

US Patent 10138117 · Granted Nov 27, 2018

Estimated economic value: $29,311,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Post CMP cleaning composition2025
Cleaning composition with molybdenum etching inhibitor2025
Surface modification layer for conductive feature formation2025
Formulations for high selective silicon nitride etch2025
Electric toothbrush2024
Air spacer surrounding conductive features and method forming same2024
Wet etching chemistry and method of forming semiconductor device using the same2024
Semiconductor device and method of manufacture2024
Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tun2024
Aqueous and semi-aqueous cleaners for the removal of post-etch residues with tun2024
Eyelash curler2024
Surface modification layer for conductive feature formation2024