Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multichip package link

Multichip package link

US Patent 10073808 · Granted Sep 11, 2018

Estimated economic value: $19,778,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

On-package die-to-die (D2D) interconnect for memory using universal chiplet inte2025
On-package die-to-die (D2D) interconnect for memory using universal chiplet inte2025
Retimers to extend a die-to-die interconnect2025
Retimers to extend a die-to-die interconnect2025
Die-to-die interconnect protocol layer2025
Die-to-die interconnect protocol layer2025
Clock interpolation system for eye-centering2025
Clock interpolation system for eye-centering2025
Standard interfaces for die to die (D2D) interconnect stacks2025
Standard interfaces for die to die (D2D) interconnect stacks2025
Valid signal for latency sensitive die-to-die (D2D) interconnects2025
Valid signal for latency sensitive die-to-die (D2D) interconnects2025