Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5445698 | Method of fabricating an internal composite layer composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer for a multilayer circuit board | Hidekazu Takano, Tokio Yoshimitsu, Akinori Hibino, Yoshihide Sawa, Motoyuki Toki +2 more | 1995-08-29 |