Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5445698 | Method of fabricating an internal composite layer composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer for a multilayer circuit board | Hidekazu Takano, Tokio Yoshimitsu, Akinori Hibino, Motoyuki Toki, Yang Wu +2 more | 1995-08-29 |
| 5160781 | Polyimide composition and prepreg and laminate thereof | Shingo Yoshioka, Kenzi Ogasawara, Tokio Yoshimitsu | 1992-11-03 |
| 5120384 | Method of manufacturing multilayer laminate | Tokio Yoshimitsu, Kouji Sato | 1992-06-09 |