Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8470938 | Resin composition for printed wiring board, prepreg, and laminate obtained with the same | Hidetsugu Motobe, Katsuhiko Ito | 2013-06-25 |
| 7566501 | Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same | Hidetsugu Motobe, Katsuhiko Ito | 2009-07-28 |
| 5837624 | Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom | Kozo Sakaguchi, Fumio Nagamine, Keita Miyasato, Hiromasa Hattori, Tatsuya Watanabe | 1998-11-17 |
| 5445698 | Method of fabricating an internal composite layer composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer for a multilayer circuit board | Hidekazu Takano, Tokio Yoshimitsu, Yoshihide Sawa, Motoyuki Toki, Yang Wu +2 more | 1995-08-29 |