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Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board |
Daisuke Nii, Toshiyuki Higashida |
2019-10-22 |
| 9681541 |
Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board |
Toshiyuki Higashida, Daisuke Nii |
2017-06-13 |
| 8470938 |
Resin composition for printed wiring board, prepreg, and laminate obtained with the same |
Akinori Hibino, Katsuhiko Ito |
2013-06-25 |
| 8062750 |
Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board |
Yoshihiko Nakamura, Takeshi Koizumi, Ryuji Takahashi |
2011-11-22 |
| 7566501 |
Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
Akinori Hibino, Katsuhiko Ito |
2009-07-28 |
| 6231959 |
Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
Yoshihiko Nakamura, Masahiro Matsumura, Narimasa Iwamoto, Yukio Hatta |
2001-05-15 |