Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10450405 | Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board | Daisuke Nii, Toshiyuki Higashida | 2019-10-22 |
| 9681541 | Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board | Toshiyuki Higashida, Daisuke Nii | 2017-06-13 |
| 8470938 | Resin composition for printed wiring board, prepreg, and laminate obtained with the same | Akinori Hibino, Katsuhiko Ito | 2013-06-25 |
| 8062750 | Epoxy resin composition for prepreg, prepreg and multilayered printed wiring board | Yoshihiko Nakamura, Takeshi Koizumi, Ryuji Takahashi | 2011-11-22 |
| 7566501 | Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same | Akinori Hibino, Katsuhiko Ito | 2009-07-28 |
| 6231959 | Prepreg of epoxy resin, hardener, and organodialkyurea promotor | Yoshihiko Nakamura, Masahiro Matsumura, Narimasa Iwamoto, Yukio Hatta | 2001-05-15 |