Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10450405 | Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board | Daisuke Nii, Hidetsugu Motobe | 2019-10-22 |
| 9681541 | Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board | Hidetsugu Motobe, Daisuke Nii | 2017-06-13 |