Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5445698 | Method of fabricating an internal composite layer composed of an electrically insulating substrate with a copper layer formed thereon and a film of a coupling agent covering the copper layer for a multilayer circuit board | Tokio Yoshimitsu, Akinori Hibino, Yoshihide Sawa, Motoyuki Toki, Yang Wu +2 more | 1995-08-29 |
| 4866134 | Laminate with layer of rubber-modified vinyl ester and unsaturated polyester | Tetsuo Kunitomi, Shigehiro Okada, Toshio Awaji, Katsuaki Shindo, Daisuke Atobe | 1989-09-12 |