Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8283204 | Optimized lid attach process for thermal management and multi-surface compliant heat removal | Vadim Gektin | 2012-10-09 |
| 7939364 | Optimized lid attach process for thermal management and multi-surface compliant heat removal | Vadim Gektin | 2011-05-10 |
| 7301227 | Package lid or heat spreader for microprocessor packages | Vadim Gektin | 2007-11-27 |
| 6944025 | EMI shielding apparatus | David Hockanson, Ron Zhang, George Zacharisen | 2005-09-13 |
| 6727193 | Apparatus and methods for enhancing thermal performance of integrated circuit packages | Vadim Gektin | 2004-04-27 |
| 6637506 | Multi-material heat spreader | Vadim Gektin | 2003-10-28 |
| 6636825 | Component level, CPU-testable, multi-chip package using grid arrays | Renukanthan Raman, Christopher Furman | 2003-10-21 |
| 6472900 | Efficient device debug system | Shahid Ansari, Hanxi Chen, Bidyut Sen, Steven R. Boyle | 2002-10-29 |
| 6436737 | Method for reducing soft error rates in semiconductor devices | — | 2002-08-20 |
| 6351389 | Device and method for packaging an electronic device | — | 2002-02-26 |
| 6246252 | Efficient debug package design | Shahid Ansari, Hanxi Chen, Bidyut Sen, Steven R. Boyle | 2001-06-12 |
| 5972736 | Integrated circuit package and method | Mario John Dominic Lee, Ehsan Ettehadieh, Nagaraj Mitty | 1999-10-26 |
| 5831333 | Integrated junction temperature sensor/package design and method of implementing same | Douglas W. Forehand | 1998-11-03 |
| 5780930 | Method for direct attachment of an on-chip bypass capacitor in an integrated circuit | Shahid Ansari, Eric Bogatin | 1998-07-14 |
| 5734554 | Heat sink and fan for cooling CPU chip | Nagaraj Mitty, Herbert E. LeCornu | 1998-03-31 |
| 5701085 | Apparatus for testing flip chip or wire bond integrated circuits | Lee Hanson, Jean Kahahane | 1997-12-23 |
| 5629240 | Method for direct attachment of an on-chip bypass capacitor in an integrated circuit | Shahid Ansari, Eric Bogatin | 1997-05-13 |
| 5598035 | Integrated circuit package with external storage capacitor for improved signal quality for sensitive integrated circuit elements | Stefan Rusu, Clayton L. Yee, Alan C. Rogers | 1997-01-28 |
| 5528083 | Thin film chip capacitor for electrical noise reduction in integrated circuits | Eric Bogatin, Bahram Zand | 1996-06-18 |
| 5367193 | Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die | — | 1994-11-22 |