Deviprasad Malladi — 20 Patents at Oracle

Deviprasad Malladi has been granted 20 US patents while listed as an inventor at Oracle. The first was granted in 1994 and the most recent in October 2012. Deviprasad Malladi ranks #214,803 of 4,157,543 US inventors in our database (top 5.2%). Patent records list Deviprasad Malladi in Campbell, CA, US.

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
8283204	Optimized lid attach process for thermal management and multi-surface compliant heat removal	Vadim Gektin	2012-10-09	$32,637,000
7939364	Optimized lid attach process for thermal management and multi-surface compliant heat removal	Vadim Gektin	2011-05-10	$49,197,000
7301227	Package lid or heat spreader for microprocessor packages	Vadim Gektin	2007-11-27	$20,325,000
6944025	EMI shielding apparatus	David Hockanson, Ron Zhang, George Zacharisen	2005-09-13	$4,666,000
6727193	Apparatus and methods for enhancing thermal performance of integrated circuit packages	Vadim Gektin	2004-04-27	$10,685,000
6637506	Multi-material heat spreader	Vadim Gektin	2003-10-28	$10,782,000
6636825	Component level, CPU-testable, multi-chip package using grid arrays	Renukanthan Raman, Christopher Furman	2003-10-21	$10,715,000
6472900	Efficient device debug system	Shahid Ansari, Hanxi Chen, Bidyut Sen, Steven R. Boyle	2002-10-29	$9,287,000
6436737	Method for reducing soft error rates in semiconductor devices	—	2002-08-20	$14,644,000
6351389	Device and method for packaging an electronic device	—	2002-02-26	$38,315,000
6246252	Efficient debug package design	Shahid Ansari, Hanxi Chen, Bidyut Sen, Steven R. Boyle	2001-06-12	$64,674,000
5972736	Integrated circuit package and method	Mario John Dominic Lee, Ehsan Ettehadieh, Nagaraj Mitty	1999-10-26	$66,006,000
5831333	Integrated junction temperature sensor/package design and method of implementing same	Douglas W. Forehand	1998-11-03	$15,240,000
5780930	Method for direct attachment of an on-chip bypass capacitor in an integrated circuit	Shahid Ansari, Eric Bogatin	1998-07-14	$24,553,000
5734554	Heat sink and fan for cooling CPU chip	Nagaraj Mitty, Herbert E. LeCornu	1998-03-31	$15,071,000
5701085	Apparatus for testing flip chip or wire bond integrated circuits	Lee Hanson, Jean Kahahane	1997-12-23	$18,897,000
5629240	Method for direct attachment of an on-chip bypass capacitor in an integrated circuit	Shahid Ansari, Eric Bogatin	1997-05-13	$18,239,000
5598035	Integrated circuit package with external storage capacitor for improved signal quality for sensitive integrated circuit elements	Stefan Rusu, Clayton L. Yee, Alan C. Rogers	1997-01-28	$58,061,000
5528083	Thin film chip capacitor for electrical noise reduction in integrated circuits	Eric Bogatin, Bahram Zand	1996-06-18	$37,098,000
5367193	Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die	—	1994-11-22	$6,380,000

Deviprasad Malladi — 20 Patents

Issued Patents All Time

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