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Optimized lid attach process for thermal management and multi-surface compliant heat removal |
Vadim Gektin |
2012-10-09 |
| 7939364 |
Optimized lid attach process for thermal management and multi-surface compliant heat removal |
Vadim Gektin |
2011-05-10 |
| 7301227 |
Package lid or heat spreader for microprocessor packages |
Vadim Gektin |
2007-11-27 |
| 6944025 |
EMI shielding apparatus |
David Hockanson, Ron Zhang, George Zacharisen |
2005-09-13 |
| 6727193 |
Apparatus and methods for enhancing thermal performance of integrated circuit packages |
Vadim Gektin |
2004-04-27 |
| 6637506 |
Multi-material heat spreader |
Vadim Gektin |
2003-10-28 |
| 6636825 |
Component level, CPU-testable, multi-chip package using grid arrays |
Renukanthan Raman, Christopher Furman |
2003-10-21 |
| 6472900 |
Efficient device debug system |
Shahid Ansari, Hanxi Chen, Bidyut Sen, Steven R. Boyle |
2002-10-29 |
| 6436737 |
Method for reducing soft error rates in semiconductor devices |
— |
2002-08-20 |
| 6351389 |
Device and method for packaging an electronic device |
— |
2002-02-26 |
| 6246252 |
Efficient debug package design |
Shahid Ansari, Hanxi Chen, Bidyut Sen, Steven R. Boyle |
2001-06-12 |
| 5972736 |
Integrated circuit package and method |
Mario John Dominic Lee, Ehsan Ettehadieh, Nagaraj Mitty |
1999-10-26 |
| 5831333 |
Integrated junction temperature sensor/package design and method of implementing same |
Douglas W. Forehand |
1998-11-03 |
| 5780930 |
Method for direct attachment of an on-chip bypass capacitor in an integrated circuit |
Shahid Ansari, Eric Bogatin |
1998-07-14 |
| 5734554 |
Heat sink and fan for cooling CPU chip |
Nagaraj Mitty, Herbert E. LeCornu |
1998-03-31 |
| 5701085 |
Apparatus for testing flip chip or wire bond integrated circuits |
Lee Hanson, Jean Kahahane |
1997-12-23 |
| 5629240 |
Method for direct attachment of an on-chip bypass capacitor in an integrated circuit |
Shahid Ansari, Eric Bogatin |
1997-05-13 |
| 5598035 |
Integrated circuit package with external storage capacitor for improved signal quality for sensitive integrated circuit elements |
Stefan Rusu, Clayton L. Yee, Alan C. Rogers |
1997-01-28 |
| 5528083 |
Thin film chip capacitor for electrical noise reduction in integrated circuits |
Eric Bogatin, Bahram Zand |
1996-06-18 |
| 5367193 |
Low cost, thermally efficient, and surface mountable semiconductor package for a high applied power VLSI die |
— |
1994-11-22 |
