Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7193330 | Semiconductor device with improved design freedom of external terminal | — | 2007-03-20 |
| 7151320 | Semiconductor device with improved design freedom of external terminal | — | 2006-12-19 |
| 7087514 | Substrate having built-in semiconductor apparatus and manufacturing method thereof | — | 2006-08-08 |
| 7053486 | Semiconductor device with improved design freedom of external terminal | — | 2006-05-30 |
| 7049224 | Manufacturing method of electronic components embedded substrate | — | 2006-05-23 |
| 6969916 | Substrate having built-in semiconductor apparatus and manufacturing method thereof | — | 2005-11-29 |
| 6914327 | Semiconductor device and manufacturing method thereof | — | 2005-07-05 |
| 6894384 | Semiconductor device and method of manufacturing the same | — | 2005-05-17 |
| 6888222 | Semiconductor device | — | 2005-05-03 |
| 6852617 | Semiconductor device fabrication method | Takashi Ohsumi | 2005-02-08 |
| 6841884 | Semiconductor device | — | 2005-01-11 |
| 6569755 | Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the same | Shigeru Yamada, Yasufumi Uchida, Noriko Murakami | 2003-05-27 |
| 6459145 | Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductor | Shigeru Yamada, Yasufumi Uchida, Noriko Murakami | 2002-10-01 |
| 6188133 | Semiconductor with plurality of connecting parts arranged on lower surface of a substrate | — | 2001-02-13 |
| 6177725 | Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the same | Shigeru Yamada, Yasufumi Uchida, Noriko Murakami | 2001-01-23 |
| 5864174 | Semiconductor device having a die pad structure for preventing cracks in a molding resin | Shigeru Yamada, Yasufumi Uchida, Noriko Murakami | 1999-01-26 |