Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8211750 | Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor | — | 2012-07-03 |
| 8164164 | Semiconductor wafer, and semiconductor device formed therefrom | — | 2012-04-24 |
| 7915746 | Semiconductor wafer, and semiconductor device formed therefrom | — | 2011-03-29 |
| 7667315 | Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein | — | 2010-02-23 |
| 7528005 | Method of manufacturing chip size package semiconductor device without intermediate substrate | Yoshikazu Takahashi | 2009-05-05 |
| 7358608 | Semiconductor device having chip size package with improved strength | — | 2008-04-15 |
| 7180185 | Semiconductor device with connections for bump electrodes | — | 2007-02-20 |
| 7129579 | Semiconductor apparatus and method for fabricating the same | — | 2006-10-31 |
| 7045908 | Semiconductor device and method for manufacturing the same | — | 2006-05-16 |
| 6979592 | Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stress | — | 2005-12-27 |
| 6893943 | Method of dividing a semiconductor wafer | Yuzo Kato | 2005-05-17 |
| 6852617 | Semiconductor device fabrication method | Yoshinori Shizuno | 2005-02-08 |
| 6841875 | Semiconductor device | — | 2005-01-11 |
| 6765299 | Semiconductor device and the method for manufacturing the same | Yoshikazu Takahashi | 2004-07-20 |
| 6713319 | Method for fabricating a semiconductor apparatus including a sealing member with reduced thermal stress | — | 2004-03-30 |
| 6590274 | Semiconductor wafer and method for manufacturing semiconductor devices | Yuzo Kato | 2003-07-08 |
| 6331449 | Method of forming a dicing area of a semicondutor substrate | — | 2001-12-18 |
| 6303470 | Semiconductor wafer and method for manufacturing semiconductor devices | Yuzo Kato | 2001-10-16 |
| 6281111 | Semiconductor apparatus and method for fabricating the same | — | 2001-08-28 |
| 6097091 | Semiconductor apparatus having an insulating layer of varying height therein | — | 2000-08-01 |