SM

Saburo Miyamoto

ND Nitto Denko: 14 patents #223 of 2,479Top 9%
Sharp Kabushiki Kaisha: 2 patents #5,184 of 10,731Top 50%
WC Wakai Holdings Co.: 2 patents #4 of 8Top 50%
📍 Ibaraki, JP: #427 of 6,779 inventorsTop 7%
Overall (All Time): #240,419 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
8395595 Touch sensor, display device with touch sensor, and method of generating location data Toshihisa Nakano 2013-03-12
8349106 Adhesive tape joining method and adhesive tape joining apparatus Yukitoshi Hase, Masayuki Yamamoto 2013-01-08
8097121 Protective tape separation method and protective tape separation apparatus Masayuki Yamamoto 2012-01-17
8062474 Protective tape separation method and apparatus using the same Masayuki Yamamoto 2011-11-22
8031180 Touch sensor, display with touch sensor, and method for generating position data Toshihisa Nakano 2011-10-04
7984737 Adhesive tape cutting method and adhesive tape joining apparatus using the same Masayuki Yamamoto 2011-07-26
7913735 Adhesive tape joining apparatus Masayuki Yamamoto 2011-03-29
7849900 Apparatus for joining a separating adhesive tape Yasuji Kaneshima, Masayuki Yamamoto 2010-12-14
7393757 Method for separating semiconductor wafer from supporting member, and apparatus using the same Yukitoshi Hase 2008-07-01
7387951 Method of dicing semiconductor wafer into chips, and apparatus using this method Masayuki Yamamoto 2008-06-17
7384811 Method of separating semiconductor wafer, and separating apparatus using the same Yukitoshi Hase 2008-06-10
7078316 Substrate joining apparatus Yukitoshi Hase, Masaru Irie 2006-07-18
6272814 Method of packaging nut assemblies Kazuichi Ikuta 2001-08-14
6235144 Resist removing apparatus and method Masayuki Yamamoto, Makoto Namikawa, Eiji Toyoda, Shigeji Kuroda, Takao Matsushita 2001-05-22
6099675 Resist removing method Masayuki Yamamoto, Makoto Namikawa, Eiji Toyoda, Shigeji Kuroda, Takao Matsushita 2000-08-08
5891298 Method and apparatus for peeling protective adhesive tape from semiconductor wafer Shigeji Kuroda, Takao Matsushita 1999-04-06
5759006 Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith Minoru Ametani 1998-06-02
5688090 Screw assembly 1997-11-18
4204905 Taping machine 1980-05-27