Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9142441 | Method of mounting a semiconductor wafer with a support board on a supporting adhesive tape joined to a ring frame | Masayuki Yamamoto, Naoki Ishii | 2015-09-22 |
| 8281838 | Work bonding and supporting method and work bonding and supporting apparatus using the same | Masayuki Yamamoto | 2012-10-09 |
| 8109185 | Method for cutting protective tape of semiconductor wafer and protective tape cutting device | Masayuki Yamamoto, Yukitoshi Hase | 2012-02-07 |
| 8110058 | Work bonding and supporting method and work bonding and supporting apparatus using the same | Masayuki Yamamoto | 2012-02-07 |
| 8042441 | Method for cutting protective tape of semiconductor wafer and apparatus for cutting the protective tape | Takashi Nishinohama, Masayuki Yamamoto | 2011-10-25 |
| 7987886 | Protective tape joining apparatus | Masayuki Yamamoto | 2011-08-02 |
| 7987888 | Releasing method and releasing apparatus of work having adhesive tape | Masayuki Yamamoto | 2011-08-02 |
| 7896050 | Apparatus for cutting the protective tape of semiconductor wafer | Masayuki Yamamoto | 2011-03-01 |
| 7849900 | Apparatus for joining a separating adhesive tape | Saburo Miyamoto, Masayuki Yamamoto | 2010-12-14 |
| 7406759 | Releasing method and releasing apparatus of work having adhesive tape | Masayuki Yamamoto | 2008-08-05 |