Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6249943 | Automatic semiconductor wafer applying apparatus | Takao Matsushita, Yoshinobu Ide | 2001-06-26 |
| 6235144 | Resist removing apparatus and method | Masayuki Yamamoto, Makoto Namikawa, Eiji Toyoda, Saburo Miyamoto, Takao Matsushita | 2001-05-22 |
| 6099675 | Resist removing method | Masayuki Yamamoto, Makoto Namikawa, Eiji Toyoda, Saburo Miyamoto, Takao Matsushita | 2000-08-08 |
| 5891298 | Method and apparatus for peeling protective adhesive tape from semiconductor wafer | Takao Matsushita, Saburo Miyamoto | 1999-04-06 |
| 5246524 | Semiconductor wafer processing system | Toshiyuki Sekido, Kazuhiro Noda, Matsuro Kinbara | 1993-09-21 |