Issued Patents All Time
Showing 101–125 of 141 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10427945 | Ion sieve material, and methods of preparing and using the same | Wei Hu, Fanghua Chen, Weihua Wan, Peng Zhou, Yunfei Zhang | 2019-10-01 |
| 10321028 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang +4 more | 2019-06-11 |
| 10274694 | Manufacturing method of a molded photosensitive assembly of an array imaging module | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2019-04-30 |
| 10230879 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2019-03-12 |
| 10197890 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2019-02-05 |
| 10194064 | Array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2019-01-29 |
| 10192914 | Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Feifan Chen, Qimin Mei +4 more | 2019-01-29 |
| 10175447 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2019-01-08 |
| 10171716 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2019-01-01 |
| 10149662 | 3D mechanical probe | Shengli Tang, Leyun Bai, Zhenchang Wang | 2018-12-11 |
| 10148859 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2018-12-04 |
| 10136041 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-11-20 |
| 10123776 | Ultrasonic probe, connection component for array elements and ultrasonic imaging system thereof | Ming Tang | 2018-11-13 |
| 10126519 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2018-11-13 |
| 10129451 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-11-13 |
| 10129452 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2018-11-13 |
| 10110791 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2018-10-23 |
| 10051167 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-08-14 |
| 10033913 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2018-07-24 |
| 9998644 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-06-12 |
| 9992397 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2018-06-05 |
| 9955055 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2018-04-24 |
| 9906700 | Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Heng Jiang +4 more | 2018-02-27 |
| 9900487 | Camera module and array camera module based on integral packaging technology | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2018-02-20 |
| 9894772 | Manufacturing method of molded photosensitive assembly for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2018-02-13 |