Issued Patents All Time
Showing 51–75 of 141 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401913 | Yaw calibration method and system for wind turbine | Zhongwei LIN, Chenzhi Qu, Chuanxi WANG, Xiangyu Han, Zhen Xie +3 more | 2022-08-02 |
| 11399122 | Adjustable camera module and assembly test method therefor | Zhen Huang, Xiaodi Liu | 2022-07-26 |
| 11393862 | Manufacture of semiconductor module with dual molding | Mingzhu Wang, Nan Guo, Bojie Zhao, Takehiko Tanaka, Feifan Chen +1 more | 2022-07-19 |
| 11388320 | Photosensitive component, and camera module and manufacturing method therefor | Mingzhu Wang, Zhongyu Luan, Zhen Huang, Nan Guo, Fengsheng Xi +5 more | 2022-07-12 |
| 11363184 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2022-06-14 |
| 11289521 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device | Mingzhu Wang, Nan Guo, Bojie Zhao, Takehiko Tanaka, Zhen Huang +2 more | 2022-03-29 |
| 11233079 | Camera module and molded circuit board assembly thereof, array camera module and electronic device | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Jingfei He, Zhen Huang +2 more | 2022-01-25 |
| 11223751 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao, Zhen Huang +4 more | 2022-01-11 |
| 11199863 | User side load response method based on adjustment and control on temperature of load clusters | Jijun Yin, Zuofeng Li, Gang Chen, Haifeng Li, Yefeng Jiang +16 more | 2021-12-14 |
| 11176028 | System, method and storage device for CIM/E model standard compliance test | Linpeng Zhang, Yujia Li, Qingbo Yang, Lixin Li, Fangchun Di +4 more | 2021-11-16 |
| 11165941 | Array camera module and application thereof | Mingzhu Wang, Bojie Zhao, Nan Guo, Takehiko Tanaka | 2021-11-02 |
| 11163216 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhen Huang +4 more | 2021-11-02 |
| 11139328 | Manufacture of semiconductor module with transparent molding component | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Bojie Zhao | 2021-10-05 |
| 11130917 | Modified Y-type molecular sieve, catalytic cracking catalyst comprising the same, their preparation and application thereof | Hao Sha, Lingping Zhou, Shuai Yuan, Weilin Zhang, Mingde Xu +1 more | 2021-09-28 |
| 11128787 | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Bojie Zhao, Zhewen Mei | 2021-09-21 |
| 11094727 | Camera module, molding photosensitive assembly thereof, manufacturing method thereof and electronic device | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Bojie Zhao | 2021-08-17 |
| 11081518 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Heng Jiang, Nan Guo | 2021-08-03 |
| 11081885 | Battery energy storage grid-load interactive method, terminal, system and medium for superimposed control | Jijun Yin, Yong Xia, Xiaofeng Wang, Yaohong Li, Xiao Lu +12 more | 2021-08-03 |
| 11052381 | Modified Y-type molecular sieve, preparation thereof and catalyst comprising the same | Lingping Zhou, Weilin Zhang, Mingde Xu, Huiping Tian, Yuxia Zhu | 2021-07-06 |
| 11053129 | Magnesium modified Y-type molecular sieve, preparation thereof and catalyst comprising the same | Lingping Zhou, Weilin Zhang, Mingde Xu, Huiping Tian, Yuxia Zhu | 2021-07-06 |
| 11049898 | Systems and methods for manufacturing semiconductor modules | Mingzhu Wang, Nan Guo, Jingfei He, Bojie Zhao, Takehiko Tanaka +4 more | 2021-06-29 |
| 11043808 | Method for identifying pattern of load cycle | Dapeng Li, Yunhao Huang, Fangchun Di, Lixin Li, Guangyi Liu +4 more | 2021-06-22 |
| 11039052 | Camera module and molding circuit board assembly, circuit board and application thereof | Mingzhu Wang, Duanliang Cheng, Fengsheng Xi, Bojie Zhao, Takehiko Tanaka +2 more | 2021-06-15 |
| 11032454 | Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device | Mingzhu Wang, Duanliang Cheng, Takehiko Tanaka, Bojie Zhao, Nan Guo +1 more | 2021-06-08 |
| 10986258 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng | 2021-04-20 |