Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11979136 | Air gap type semiconductor device package structure | Yunxiang Di, Situo Xu | 2024-05-07 |
| 11917918 | Fingerprint identification module, method for forming fingerprint identification module, and electronic device | Hu SHI, Yanghui Xiang | 2024-02-27 |
| 11695387 | Air gap type semiconductor device package structure and fabrication method thereof | Yunxiang Di, Situo Xu | 2023-07-04 |
| 11444244 | Mask plate and fabrication method thereof | Hailong LUO | 2022-09-13 |
| 11430825 | Image capturing assembly, lens module and electronic device | Da-Jung Chen | 2022-08-30 |
| 11309279 | Package structure of wafer-level system-in-package | Hailong LUO | 2022-04-19 |
| 11296141 | Image capturing assembly and packaging method thereof, lens module, and electronic device | Da-Jung Chen | 2022-04-05 |
| 11171166 | Camera assembly and packaging method thereof, lens module, electronic device | Da-Jung Chen | 2021-11-09 |
| 11069670 | Camera assembly and packaging method thereof, lens module, and electronic device | Da-Jung Chen | 2021-07-20 |
| 11049816 | Alignment mark and semiconductor device, and fabrication methods thereof | — | 2021-06-29 |
| 10930617 | Packaging method and package structure of wafer-level system-in-package | — | 2021-02-23 |
| 10887499 | Camera assembly and packaging methods thereof, lens module, and electronic device | Da-Jung Chen | 2021-01-05 |
| 10861895 | Image capturing assembly and packaging method thereof, lens module and electronic device | Da-Jung Chen | 2020-12-08 |
| 10861821 | Packaging method and package structure of wafer-level system-in-package | Hailong LUO | 2020-12-08 |
| 10811385 | Wafer-level system-in-package structure and electronic apparatus thereof | — | 2020-10-20 |
| 10756056 | Methods and structures for wafer-level system in package | — | 2020-08-25 |
| 10755979 | Wafer-level packaging methods using a photolithographic bonding material | Hu SHI | 2020-08-25 |
| 10490589 | Image sensor module and method for forming the same | — | 2019-11-26 |