Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11979136 | Air gap type semiconductor device package structure | Yunxiang Di, Mengbin Liu | 2024-05-07 |
| 11695387 | Air gap type semiconductor device package structure and fabrication method thereof | Yunxiang Di, Mengbin Liu | 2023-07-04 |