Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224730 | Manufacturing method of a composite substrate of an acoustic wave resonator | Herb He Huang, Wei Li, Fei Qi | 2025-02-11 |
| 12081191 | Packaging method of a film bulk acoustic resonator | — | 2024-09-03 |
| 12057820 | Thin film piezoelectric acoustic wave resonator and manufacturing method therefor, and filter | Herb He Huang, Wei Li, Fei Qi | 2024-08-06 |
| 12028043 | Packaging method and packaging structure of FBAR | — | 2024-07-02 |
| 12009803 | Bulk acoustic wave resonator, filter and radio frequency communication system | — | 2024-06-11 |
| 11870410 | Packaging method and packaging structure of film bulk acoustic resonator | Wei Li, Fei Qi | 2024-01-09 |
| 11764245 | Fabrication method of photodetector and imaging sensor | — | 2023-09-19 |
| 11562980 | Wafer-level package structure | Clifford Drowley | 2023-01-24 |
| 11450582 | Wafer-level package structure | Clifford Drowley | 2022-09-20 |
| 11444244 | Mask plate and fabrication method thereof | Mengbin Liu | 2022-09-13 |
| 11309279 | Package structure of wafer-level system-in-package | Mengbin Liu | 2022-04-19 |
| 11101311 | Photodetector and fabrication method, and imaging sensor | — | 2021-08-24 |
| 10978421 | Wafer-level packaging method and package structure | Clifford Drowley | 2021-04-13 |
| 10910286 | Wafer-level system-in-package packaging method and package structure thereof | Clifford Drowley | 2021-02-02 |
| 10861821 | Packaging method and package structure of wafer-level system-in-package | Mengbin Liu | 2020-12-08 |
| 10861822 | Wafer-level packaging method and package structure thereof | Clifford Drowley | 2020-12-08 |
| 10804177 | Wafer-level packaging method and package structure thereof | Clifford Drowley | 2020-10-13 |
| 10790211 | Wafer-level packaging method and package structure thereof | Clifford Drowley | 2020-09-29 |
| 10784229 | Wafer level package structure and wafer level packaging method | Clifford Drowley | 2020-09-22 |
| 10756051 | Wafer-level system packaging method and package structure | Clifford Drowley | 2020-08-25 |