Issued Patents All Time
Showing 25 most recent of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12219708 | Electronic module | Chien-Ming Chen | 2025-02-04 |
| 12094644 | Electronic structure having a transformer | Chi-Feng Huang | 2024-09-17 |
| 11848146 | Stacked electronic module and method to make the same | Chien-Ming Chen | 2023-12-19 |
| 11744009 | Electronic module | Kaipeng Chiang, Bau-Ru Lu, Chun-Hsien Lu | 2023-08-29 |
| 11651890 | Electronic structure having a transformer | Chi-Feng Huang | 2023-05-16 |
| 11430825 | Image capturing assembly, lens module and electronic device | Mengbin Liu | 2022-08-30 |
| 11333318 | Switch display apparatus and assembling method thereof | Yongping Miao, Weihui Liu, Bing Chen, Junying Wei, Kun Dai | 2022-05-17 |
| 11296141 | Image capturing assembly and packaging method thereof, lens module, and electronic device | Mengbin Liu | 2022-04-05 |
| 11171166 | Camera assembly and packaging method thereof, lens module, electronic device | Mengbin Liu | 2021-11-09 |
| 11153973 | Electronic module | Kaipeng Chiang, Bau-Ru Lu, Chun-Hsien Lu | 2021-10-19 |
| 11069670 | Camera assembly and packaging method thereof, lens module, and electronic device | Mengbin Liu | 2021-07-20 |
| 11031255 | Stack frame for electrical connections and the method to fabricate thereof | Bau-Ru Lu, Yi-Cheng Lin | 2021-06-08 |
| 11017934 | Electronic module | Bau-Ru Lu, Chun-Hsien Lu | 2021-05-25 |
| 10991681 | Three-dimensional package structure | Chun-Tiao Liu, Chau-Chun Wen | 2021-04-27 |
| 10886315 | Photosensitive assembly and formation methods thereof, lens module, and electronic device | — | 2021-01-05 |
| 10887499 | Camera assembly and packaging methods thereof, lens module, and electronic device | Mengbin Liu | 2021-01-05 |
| 10861895 | Image capturing assembly and packaging method thereof, lens module and electronic device | Mengbin Liu | 2020-12-08 |
| 10741531 | Method to form a stacked electronic structure | Chi-Feng Huang, Bau-Ru Lu | 2020-08-11 |
| 10593561 | Stack frame for electrical connections and the method to fabricate thereof | Bau-Ru Lu, Yi-Cheng Lin | 2020-03-17 |
| 10593656 | Three-dimensional package structure | Chun-Tiao Liu, Chau-Chun Wen | 2020-03-17 |
| 10199361 | Stacked electronic structure | Chi-Feng Huang, Bau-Ru Lu | 2019-02-05 |
| 10083925 | Packaging process of electronic component | Qin Cai | 2018-09-25 |
| 10084389 | Power module | Yiu-Wai Lai | 2018-09-25 |
| 10034379 | Stacked electronic structure | Chi-Feng Huang, Bau-Ru Lu | 2018-07-24 |
| 9978611 | Stack frame for electrical connections and the method to fabricate thereof | Bau-Ru Lu, Yi-Cheng Lin | 2018-05-22 |