Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11744009 | Electronic module | Kaipeng Chiang, Da-Jung Chen, Chun-Hsien Lu | 2023-08-29 |
| 11419214 | Power supply module used in a smart terminal and power supply module assembly structure | Pengkai Ji, Jianhong Zeng, Yu Zhang, Shouyu Hong, Jinping Zhou | 2022-08-16 |
| 11153973 | Electronic module | Kaipeng Chiang, Da-Jung Chen, Chun-Hsien Lu | 2021-10-19 |
| 11134570 | Electronic module with a magnetic device | Chun-Hsien Lu, Kaipeng Chiang | 2021-09-28 |
| 11031255 | Stack frame for electrical connections and the method to fabricate thereof | Da-Jung Chen, Yi-Cheng Lin | 2021-06-08 |
| 11024702 | Stacked electronic structure | Jianhong Zeng, Chun-Hsien Lu | 2021-06-01 |
| 11017934 | Electronic module | Chun-Hsien Lu, Da-Jung Chen | 2021-05-25 |
| 10854575 | Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure | Ming-Chia Wu, Shao-Wei Lu | 2020-12-01 |
| 10856417 | Power supply module used in a smart terminal and power supply module assembly structure | Pengkai Ji, Jianhong Zeng, Yu Zhang, Shouyu Hong, Jinping Zhou | 2020-12-01 |
| 10741531 | Method to form a stacked electronic structure | Chi-Feng Huang, Da-Jung Chen | 2020-08-11 |
| 10636735 | Package structure and the method to fabricate thereof | Jeng-Jen Li, Kaipeng Chiang | 2020-04-28 |
| 10593561 | Stack frame for electrical connections and the method to fabricate thereof | Da-Jung Chen, Yi-Cheng Lin | 2020-03-17 |
| 10529680 | Encapsulated electronic device mounted on a redistribution layer | Ming-Chia Wu | 2020-01-07 |
| 10433424 | Electronic module and the fabrication method thereof | Chun-Tiao Liu | 2019-10-01 |
| 10373930 | Package structure and the method to fabricate thereof | Jeng-Jen Li | 2019-08-06 |
| 10373894 | Package structure and the method to fabricate thereof | Jeng-Jen Li, Kun-Hong Shih, Kaipeng Chiang | 2019-08-06 |
| 10297573 | Three-dimensional package structure and the method to fabricate thereof | Ming-Chia Wu, Shao-Wei Lu | 2019-05-21 |
| 10212817 | Electronic module with a magnetic device | Chun-Hsien Lu, Kaipeng Chiang | 2019-02-19 |
| 10199361 | Stacked electronic structure | Chi-Feng Huang, Da-Jung Chen | 2019-02-05 |
| 10128214 | Substrate and the method to fabricate thereof | Ming-Chia Wu, Shao-Wei Lu | 2018-11-13 |
| 10063098 | Electronic module and method for forming package | Huei-Ren You, Kaipeng Chiang | 2018-08-28 |
| 10034379 | Stacked electronic structure | Chi-Feng Huang, Da-Jung Chen | 2018-07-24 |
| 9984996 | Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor | Ming-Chia Wu, Shao-Wei Lu | 2018-05-29 |
| 9978611 | Stack frame for electrical connections and the method to fabricate thereof | Da-Jung Chen, Yi-Cheng Lin | 2018-05-22 |
| 9911715 | Three-dimensional package structure and the method to fabricate thereof | Ming-Chia Wu, Shao-Wei Lu | 2018-03-06 |