Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10636735 | Package structure and the method to fabricate thereof | Bau-Ru Lu, Kaipeng Chiang | 2020-04-28 |
| 10373930 | Package structure and the method to fabricate thereof | Bau-Ru Lu | 2019-08-06 |
| 10373894 | Package structure and the method to fabricate thereof | Bau-Ru Lu, Kun-Hong Shih, Kaipeng Chiang | 2019-08-06 |
| 9536798 | Package structure and the method to fabricate thereof | Bau-Ru Lu, Kun-Hong Shih, Kaipeng Chiang | 2017-01-03 |
| 9484290 | Electronic system with a composite substrate | Han-Hsiang Lee, Kun-Hong Shih | 2016-11-01 |
| 9386686 | Metal core printed circuit board and electronic package structure | Chi-Feng Huang, Bau-Ru Lu, Da-Jung Chen | 2016-07-05 |
| 8619428 | Electronic package structure | Han-Hsiang Lee, Yi-Cheng Lin, Pei-Chun Hung, Bau-Ru Lu, Da-Jung Chen | 2013-12-31 |
| 8547709 | Electronic system with a composite substrate | Han-Hsiang Lee, Kun-Hong Shih | 2013-10-01 |
| 8253041 | Electronic element packaging module | Da-Jung Chen, Chi-Feng Huang, Yi-Tsung Chen, Huei-Ren You | 2012-08-28 |
| 7405467 | Power module package structure | Chun-Tiao Liu, Da-Jung Chen, Chun-Liang Lin, Cheng-Chieh Hsu, Chau-Chun Wen | 2008-07-29 |
| 6383048 | Packaging method for organic polymer EL displays | Heng-Long Yang, Rong-Ho Lee | 2002-05-07 |