Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9735091 | Package structure and manufacturing method thereof | Yi-Cheng Lin, Da-Jung Chen | 2017-08-15 |
| 9484290 | Electronic system with a composite substrate | Jeng-Jen Li, Kun-Hong Shih | 2016-11-01 |
| 9000576 | Package structure and manufacturing method thereof | Yi-Cheng Lin, Da-Jung Chen | 2015-04-07 |
| 8619428 | Electronic package structure | Yi-Cheng Lin, Pei-Chun Hung, Bau-Ru Lu, Da-Jung Chen, Jeng-Jen Li | 2013-12-31 |
| 8547709 | Electronic system with a composite substrate | Kun-Hong Shih, Jeng-Jen Li | 2013-10-01 |
| 8269330 | MOSFET pair with stack capacitor and manufacturing method thereof | Yi-Cheng Lin, Da-Jung Chen | 2012-09-18 |