Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8154901 | Circuit providing load isolation and noise reduction | Hyun Lee, Jayesh R. Bhakta, Jeffrey C. Solomon, Mario Jesus Martinez | 2012-04-10 |
| 8033836 | Circuit with flexible portion | Jayesh R. Bhakta, Enchao Yu, Richard E. Flaig | 2011-10-11 |
| RE42363 | Stackable electronic assembly | Mark Ellsberry, Charles E. Schmitz, Victor Allison, Jon Schmidt | 2011-05-17 |
| 7839645 | Module having at least two surfaces and at least one thermally conductive layer therebetween | Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Jose Delvalle | 2010-11-23 |
| 7811097 | Circuit with flexible portion | Jayesh R. Bhakta, Enchao Yu, Richard E. Flaig | 2010-10-12 |
| 7630202 | High density module having at least two substrates and at least one thermally conductive layer therebetween | Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Jose Delvalle | 2009-12-08 |
| 7442050 | Circuit card with flexible connection for memory module with heat spreader | Jayesh R. Bhakta, Enchao Yu, Richard E. Flaig | 2008-10-28 |
| 7375970 | High density memory module using stacked printed circuit boards | Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Jose Delvalle | 2008-05-20 |
| 7254036 | High density memory module using stacked printed circuit boards | Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Jose Delvalle | 2007-08-07 |
| 7180165 | Stackable electronic assembly | Mark Ellsberry, Charles E. Schmitz, Victor Allison | 2007-02-20 |