Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8864500 | Electronic module with flexible portion | Jayesh R. Bhakta, Chi-She Chen, Richard E. Flaig | 2014-10-21 | $882,000 |
| 8705239 | Heat dissipation for electronic modules | Zhiyong An | 2014-04-22 | $1,645,000 |
| 8488325 | Memory module having thermal conduits | — | 2013-07-16 | $344,000 |
| 8287291 | Circuit with flexible portion | Jayesh R. Bhakta, Chi-She Chen, Richard E. Flaig | 2012-10-16 | $638,000 |
| 8033836 | Circuit with flexible portion | Jayesh R. Bhakta, Chi-She Chen, Richard E. Flaig | 2011-10-11 | $487,000 |
| 8018723 | Heat dissipation for electronic modules | Zhiyong An | 2011-09-13 | $570,000 |
| 7839643 | Heat spreader for memory modules | — | 2010-11-23 | $634,000 |
| 7811097 | Circuit with flexible portion | Jayesh R. Bhakta, Chi-She Chen, Richard E. Flaig | 2010-10-12 | $3,448,000 |
| 7619893 | Heat spreader for electronic modules | — | 2009-11-17 | $3,191,000 |
| 7442050 | Circuit card with flexible connection for memory module with heat spreader | Jayesh R. Bhakta, Chi-She Chen, Richard E. Flaig | 2008-10-28 | $214,000 |