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High density memory module system |
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2020-02-25 |
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Extended capacity memory system with load relieved memory and method of manufacture thereof |
Victor Mahran |
2018-04-10 |
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Satyanarayan Shivkumar Iyer, Victor Mahran |
2017-05-09 |
| 9204550 |
Extended capacity memory system with load relieved memory and method of manufacture thereof |
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2015-12-01 |
| 8971045 |
Module having at least one thermally conductive layer between printed circuit boards |
Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen, Jose Delvalle |
2015-03-03 |
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Memory module with vertically accessed interposer assemblies |
Mike Hossein Amidi, Satyanarayan Shivkumar Iyer |
2013-02-19 |
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Module having at least two surfaces and at least one thermally conductive layer therebetween |
Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen, Jose Delvalle |
2013-01-01 |
| 7839645 |
Module having at least two surfaces and at least one thermally conductive layer therebetween |
Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen, Jose Delvalle |
2010-11-23 |
| 7630202 |
High density module having at least two substrates and at least one thermally conductive layer therebetween |
Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen, Jose Delvalle |
2009-12-08 |
| 7375970 |
High density memory module using stacked printed circuit boards |
Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen, Jose Delvalle |
2008-05-20 |
| 7293997 |
Transceiver mounting adapters |
Bryan Yunker, Andrew Moore |
2007-11-13 |
| 7254036 |
High density memory module using stacked printed circuit boards |
Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen, Jose Delvalle |
2007-08-07 |
| 6930903 |
Arrangement of integrated circuits in a memory module |
Jayesh R. Bhakta |
2005-08-16 |
| 6930900 |
Arrangement of integrated circuits in a memory module |
Jayesh R. Bhakta |
2005-08-16 |
| 6873534 |
Arrangement of integrated circuits in a memory module |
Jayesh R. Bhakta |
2005-03-29 |
| 6751113 |
Arrangement of integrated circuits in a memory module |
Jayesh R. Bhakta |
2004-06-15 |