| 8971045 |
Module having at least one thermally conductive layer between printed circuit boards |
Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen |
2015-03-03 |
| 8345427 |
Module having at least two surfaces and at least one thermally conductive layer therebetween |
Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen |
2013-01-01 |
| 7839645 |
Module having at least two surfaces and at least one thermally conductive layer therebetween |
Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen |
2010-11-23 |
| 7630202 |
High density module having at least two substrates and at least one thermally conductive layer therebetween |
Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen |
2009-12-08 |
| 7375970 |
High density memory module using stacked printed circuit boards |
Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen |
2008-05-20 |
| 7254036 |
High density memory module using stacked printed circuit boards |
Robert Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi-She Chen |
2007-08-07 |