Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8878182 | Probe pad design for 3DIC package yield analysis | Tzu-Yu Wang, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Hsien-Pin Hu +2 more | 2014-11-04 |
| 8450624 | Supporting substrate and method for fabricating the same | Shao-Yang Lu, Bor-Shyang Liao | 2013-05-28 |
| 8058567 | High density package substrate and method for fabricating the same | Wei-Wen Lan, Ching-Ming Chuang, Shi-Shyan James Shang | 2011-11-15 |
| 7877873 | Method for forming a wire bonding substrate | Hung-En Hsu, Wei-Wen Lan, Yun-Hsiang Pai | 2011-02-01 |