Issued Patents All Time
Showing 51–56 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5012386 | High performance overmolded electronic package | Paul T. Lin | 1991-04-30 |
| 5006922 | Packaged semiconductor device having a low cost ceramic PGA package | Paul T. Lin, Howard P. Wilson | 1991-04-09 |
| 4924291 | Flagless semiconductor package | Israel A. Lesk, George W. Hawkins, Ronald E. Thomas, William L. Hunter, James J. Casto | 1990-05-08 |
| 4897602 | Electronic device package with peripheral carrier structure of low-cost plastic | Paul T. Lin, Charles G. Bigler, John A. Goertz, Joan M. Hamilton | 1990-01-30 |
| 4837184 | Process of making an electronic device package with peripheral carrier structure of low-cost plastic | Paul T. Lin, Charles G. Bigler, John A. Goertz | 1989-06-06 |
| 4661192 | Low cost integrated circuit bonding process | — | 1987-04-28 |