Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6868352 | Organic semiconductor product state monitor | Hakeem Adewole, Paul Brazis, Jie Zhang | 2005-03-15 |
| 6806542 | Electronic device having a filled dielectric medium | Jie Zhang, Anindya Dasgupta | 2004-10-19 |
| 6780733 | Thinned semiconductor wafer and die and corresponding method | Marc Chason, Paul Brazis, Krishna Kalyanasundaram | 2004-08-24 |
| 6677607 | Organic semiconductor device having an oxide layer | Steven Scheifers, Paul Brazis, Jie Zhang, Lawrence E. Lach | 2004-01-13 |
| 6661024 | Integrated circuit including field effect transistor and method of manufacture | Jie Zhang, Paul Brazis, Krishna Kalyanasundaram, Steven Scheifers, Jerzy Wielgus +1 more | 2003-12-09 |
| 6649852 | Micro-electro mechanical system | Marc Chason, Andrew Skipor, Aroon Tungare, Sanjar Ghaem | 2003-11-18 |
| 6603141 | Organic semiconductor and method | Lawrence E. Lach, Steven Scheifers, Jie Zhang, Paul Brazis | 2003-08-05 |
| 6585424 | Structure and method for fabricating an electro-rheological lens | Marc Chason | 2003-07-01 |
| 6570362 | Portable electronic device with enhanced battery life and cooling | Kurt Estes, Debabrata Pal, Kevin J. McDunn, Irina Shmagin | 2003-05-27 |
| 6562663 | Microelectronic assembly with die support and method | Steven Scheifers, Andrew Skipor | 2003-05-13 |
| 6541300 | Semiconductor film and process for its preparation | Abhijit Roy Chowdhuri, Jie Zhang | 2003-04-01 |
| 6391762 | Method of forming a microelectronic assembly with a particulate free underfill material and a microelectronic assembly incorporation the same | Robert Kenneth Doot, George Amos Carson | 2002-05-21 |
| 6201192 | Method and assembly for providing improved underchip encapsulation | Steven Lewis Wille | 2001-03-13 |
| 6156408 | Device for reworkable direct chip attachment | Wen Xu Zhou, Sean Xin Wu, Chao-pin Yeh, Karl W. Wyatt, Chowdary R. Koripella | 2000-12-05 |
| 6108212 | Surface-mount device package having an integral passive component | Lawrence E. Lach, Gregory J. Dunn | 2000-08-22 |
| 6083819 | Method and assembly for providing improved underchip encapsulation | Steven Lewis Wille | 2000-07-04 |
| 6034333 | Frame embedded in a polymeric encapsulant | Andrew Skipor, Chao-pin Yeh, Karl W. Wyatt, Wen Xu Zhou | 2000-03-07 |
| 5930598 | Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same | Steven Lewis Wille, Colleen Mary Walsh | 1999-07-27 |
| 5912507 | Solderable pad with integral series termination resistor | Gregory J. Dunn, Lawrence E. Lach | 1999-06-15 |
| 5821456 | Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same | Steven Lewis Wille, Colleen Mary Walsh | 1998-10-13 |
| 5814401 | Selectively filled adhesive film containing a fluxing agent | Robert W. Pennisi, Cynthia M. Melton | 1998-09-29 |
| 5804881 | Method and assembly for providing improved underchip encapsulation | Steven Lewis Wille | 1998-09-08 |
| 5720100 | Assembly having a frame embedded in a polymeric encapsulant and method for forming same | Andrew Skipor, Chao-pin Yeh, Karl W. Wyatt, Wen Xu Zhou | 1998-02-24 |
| 5704116 | Method of holding a component using an anhydride fluxing agent | Steven Lewis Wille, Steven Scheifers, Michael Hertsberg | 1998-01-06 |
| 5682066 | Microelectronic assembly including a transparent encapsulant | Alan Chen, Michael Hertsberg | 1997-10-28 |