Issued Patents All Time
Showing 51–68 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5087689 | Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines | Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1992-02-11 |
| 5086125 | Polyimide resin composition | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1992-02-04 |
| 5043419 | Process for preparing a polyimide and a composite material containing the same | Masahiro Ohta, Saburo Kawashima, Hideaki Oikawa, Akihiro Yamaguchi, Tomohito Koba +5 more | 1991-08-27 |
| 5041520 | Process for preparing polyimide having excellent high temperature stability | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1991-08-20 |
| 5013817 | Process for preparing a polyimide and a composite material containing the same | Masahiro Ohta, Saburo Kawashima, Hideaki Oikawa, Akihiro Yamaguchi, Tomohito Koba +5 more | 1991-05-07 |
| 4994544 | Production process for polyimide fibers | Taizo Nagahiro, Masahiro Ohta, Shuichi Morikawa, Nubohito Koga | 1991-02-19 |
| 4987197 | Polyimide/polyamideimide resin composition | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1991-01-22 |
| 4959440 | Polymide for high-temperature adhesive | Saburo Kawashima, Yoshiho Sonobe, Masahiro Ohta, Hideaki Oikawa, Akihiro Yamaguchi | 1990-09-25 |
| 4937316 | Process for preparing polyimides | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1990-06-26 |
| 4931531 | Polyimide and high-temperature adhesive thereof | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1990-06-05 |
| 4908409 | Polyimide | Hideaki Oikawa, Katsuaki Liyama, Nobuhito Koga, Saburo Kawashima, Masahiro Ohta +1 more | 1990-03-13 |
| 4883718 | Flexible copper-clad circuit substrate | Masahiro Ohta, Saburo Kawashima, Yoshiho Snobe, Hideaki Oikawa, Akihiro Yamaguchi | 1989-11-28 |
| 4847349 | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines | Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1989-07-11 |
| 4839232 | Flexible laminate printed-circuit board and methods of making same | Moritsugu Morita, Kazuo Miyazaki, Akihiro Yamaguchi, Masahiro Ohta, Kunio Nishihara | 1989-06-13 |
| 4797466 | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine | Hideaki Oikawa, Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Akihiro Yamaguchi | 1989-01-10 |
| 4795798 | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane | Saburo Kawashima, Masahiro Ohta, Hideaki Oikawa, Kouji Ohkoshi, Akihiro Yamaguchi | 1989-01-03 |
| 4734482 | Polyimide from ether diamine having the indane structure and high-temperature adhesive of polyimide | Saburo Kawashima, Yoshiho Sonobe, Masahiro Ohta, Hideaki Oikawa, Akihiro Yamaguchi | 1988-03-29 |
| 4687836 | Polyimide adhesives, coats and prepreg | Akira Ibi, Takushi Sato, Akihiro Yamaguchi, Shigeru Takahashi, Shigeyuki Shishido +1 more | 1987-08-18 |