Issued Patents All Time
Showing 26–50 of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5459233 | Polyimides, process for the preparation thereof and polyimide resin compositions | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1995-10-17 |
| 5380805 | Polyimides, process for the preparation thereof and polyimide resin compositions | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi +2 more | 1995-01-10 |
| 5374708 | Formed polyimide article | Masahiro Ohta, Akihiro Yamaguchi, Masumi Saruwatari | 1994-12-20 |
| 5371168 | Amorphous polyimide powder, preparation process of the powder, and heat-resistant adhesive and bonding method by use of the powder | Wataru Yamashita, Akihiro Yamaguchi | 1994-12-06 |
| 5364967 | Aromatic diamine compounds, bismalemide compounds, thermosetting resin forming compositions therefrom, resin therefrom, and methods for their preparation | Keizaburo Yamaguchi, Tatsuhiro Urakami, Yoshimitsu Tanabe, Midori Yamazaki, Norimasa Yamaya +2 more | 1994-11-15 |
| 5354890 | Aromatic diamine intermediates useful in the preparation of polyimides | Wataru Yamashita, Yuichi Okawa, Yuko Ishihara, Keizaburo Yamaguchi, Akihiro Yamaguchi | 1994-10-11 |
| 5346982 | Heat-resistant adhesive | Katsuaki Iiyama, Akihiro Yamaguchi | 1994-09-13 |
| 5322962 | Aromatic diamine intermediates useful in the preparation of polyimide | Keizaburo Yamaguchi, Yuko Ishihara, Saburo Kawashima, Hideaki Oikawa, Toshiyuki Kataoka +1 more | 1994-06-21 |
| 5300620 | Heat-resistant adhesive and method of adhesion by using adhesive | Hideaki Okikawa, Katsuaki Iiyama, Saburo Kawashima, Akihiro Yamaguchi, Tadashi Asanuma | 1994-04-05 |
| 5288843 | Polyimides, process for the preparation thereof and polyimide resin compositions | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi +2 more | 1994-02-22 |
| 5286840 | Thermally stable polyimide and preparation process of polyimide | Hideaki Oikawa, Nobuhito Koga, Akihiro Yamaguchi | 1994-02-15 |
| 5283313 | Readily processable polyimide, preparation process of polyimide, and resin composition of polyimide | Wataru Yamashita, Akihiro Yamaguchi | 1994-02-01 |
| 5278276 | Polyimide and high-temperature adhesive of polyimide | Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1994-01-11 |
| 5276133 | Favorably processable polyimide and process for preparing polyimide | Yuichi Okawa, Akihiro Yamaguchi | 1994-01-04 |
| 5268447 | Readily processable polyimide and preparation process of same | Masahiro Ohta, Akihiro Yamaguchi | 1993-12-07 |
| 5268446 | Readily processable polyimide and preparation process of same | Masahiro Ohta, Akihiro Yamaguchi | 1993-12-07 |
| 5260388 | Polyimide and process for the preparation thereof | Wataru Yamashita, Yuichi Okawa, Yuko Ishihara, Keizaburo Yamaguchi, Akihiro Yamaguchi | 1993-11-09 |
| 5252700 | Heat-resistant adhesive and method of adhesion by using adhesive | Hideaki Okikawa, Katsuaki Iiyama, Saburo Kawashima, Akihiro Yamaguchi, Tadashi Asanuma | 1993-10-12 |
| 5231160 | Aromatic diamine compound, preparation process of same and polyimide prepared from same | Keizaburo Yamaguchi, Yuko Ishihara, Saburo Kawashima, Hideaki Oikawa, Toshiyuki Kataoka +1 more | 1993-07-27 |
| 5210174 | Preparation process of polyimide | Hideaki Oikawa, Masahiro Ohta, Akihiro Yamaguchi | 1993-05-11 |
| 5205894 | Polyimide and high-temperature adhesive of polyimide | Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1993-04-27 |
| 5206438 | Aromatic diamine compounds, bismaleimide compounds, thermosetting resin forming compositions therefrom, resins therefrom, and methods for their preparation | Keizaburo Yamaguchi, Tatsuhiro Urakami, Yoshimitsu Tanabe, Midori Yamazaki, Norimasa Yamaya +2 more | 1993-04-27 |
| 5196506 | Polymide | Masahiro Ohta, Akihiro Yamaguchi | 1993-03-23 |
| 5157085 | Polyimide resin composition | Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1992-10-20 |
| 5106937 | Thermosetting resin from penta arylene bis maleimide | Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi | 1992-04-21 |