Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5604063 | Composition for charge transport layer and electrophotographic member using same | Keiichi Endo, Seiji Miyaoka, Susumu Kaneko, Yasuo Katsuya, Akira Kageyama +1 more | 1997-02-18 |
| 5534375 | Composition for forming charge transport layer and electrophotographic member containing alkoxybenzene | Susumu Kaneko, Keiichi Endo, Seiji Miyaoka, Megumi Matsui, Shigeru Hayashida +2 more | 1996-07-09 |
| 5380805 | Polyimides, process for the preparation thereof and polyimide resin compositions | Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa +2 more | 1995-01-10 |
| 5288843 | Polyimides, process for the preparation thereof and polyimide resin compositions | Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa +2 more | 1994-02-22 |
| 5278276 | Polyimide and high-temperature adhesive of polyimide | Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa +1 more | 1994-01-11 |
| 5205894 | Polyimide and high-temperature adhesive of polyimide | Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa +1 more | 1993-04-27 |
| 5155191 | Preparation process of granular polymers | Hiroshi Itoh, Takashi Abe, Atsuhiko Nitta | 1992-10-13 |
| 5087689 | Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines | Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa +1 more | 1992-02-11 |
| 4847349 | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines | Masahiro Ohta, Saburo Kawashima, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa +1 more | 1989-07-11 |
| 4795798 | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane | Shoji Tamai, Saburo Kawashima, Masahiro Ohta, Hideaki Oikawa, Akihiro Yamaguchi | 1989-01-03 |