Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5506311 | Polyimides, process for the preparation thereof and polyimide resin compositions | Shoji Tamai, Masahiro Ohta, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1996-04-09 |
| 5459233 | Polyimides, process for the preparation thereof and polyimide resin compositions | Shoji Tamai, Masahiro Ohta, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1995-10-17 |
| 5380805 | Polyimides, process for the preparation thereof and polyimide resin compositions | Shoji Tamai, Masahiro Ohta, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi +2 more | 1995-01-10 |
| 5322962 | Aromatic diamine intermediates useful in the preparation of polyimide | Shoji Tamai, Keizaburo Yamaguchi, Yuko Ishihara, Hideaki Oikawa, Toshiyuki Kataoka +1 more | 1994-06-21 |
| 5300620 | Heat-resistant adhesive and method of adhesion by using adhesive | Hideaki Okikawa, Shoji Tamai, Katsuaki Iiyama, Akihiro Yamaguchi, Tadashi Asanuma | 1994-04-05 |
| 5288843 | Polyimides, process for the preparation thereof and polyimide resin compositions | Shoji Tamai, Masahiro Ohta, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi +2 more | 1994-02-22 |
| 5278276 | Polyimide and high-temperature adhesive of polyimide | Masahiro Ohta, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1994-01-11 |
| 5252700 | Heat-resistant adhesive and method of adhesion by using adhesive | Hideaki Okikawa, Shoji Tamai, Katsuaki Iiyama, Akihiro Yamaguchi, Tadashi Asanuma | 1993-10-12 |
| 5231160 | Aromatic diamine compound, preparation process of same and polyimide prepared from same | Shoji Tamai, Keizaburo Yamaguchi, Yuko Ishihara, Hideaki Oikawa, Toshiyuki Kataoka +1 more | 1993-07-27 |
| 5205894 | Polyimide and high-temperature adhesive of polyimide | Masahiro Ohta, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1993-04-27 |
| 5157085 | Polyimide resin composition | Masahiro Ohta, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1992-10-20 |
| 5087689 | Polyimide and high-temperature adhesive of polyimide based on meta-phenoxy diamines | Masahiro Ohta, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1992-02-11 |
| 5086125 | Polyimide resin composition | Masahiro Ohta, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1992-02-04 |
| 5043419 | Process for preparing a polyimide and a composite material containing the same | Masahiro Ohta, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi, Tomohito Koba +5 more | 1991-08-27 |
| 5041520 | Process for preparing polyimide having excellent high temperature stability | Masahiro Ohta, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1991-08-20 |
| 5013817 | Process for preparing a polyimide and a composite material containing the same | Masahiro Ohta, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi, Tomohito Koba +5 more | 1991-05-07 |
| 4987197 | Polyimide/polyamideimide resin composition | Masahiro Ohta, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1991-01-22 |
| 4959440 | Polymide for high-temperature adhesive | Shoji Tamai, Yoshiho Sonobe, Masahiro Ohta, Hideaki Oikawa, Akihiro Yamaguchi | 1990-09-25 |
| 4937316 | Process for preparing polyimides | Masahiro Ohta, Katsuaki Iiyama, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1990-06-26 |
| 4931531 | Polyimide and high-temperature adhesive thereof | Shoji Tamai, Masahiro Ohta, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi | 1990-06-05 |
| 4908409 | Polyimide | Hideaki Oikawa, Katsuaki Liyama, Nobuhito Koga, Shoji Tamai, Masahiro Ohta +1 more | 1990-03-13 |
| 4883718 | Flexible copper-clad circuit substrate | Masahiro Ohta, Yoshiho Snobe, Shoji Tamai, Hideaki Oikawa, Akihiro Yamaguchi | 1989-11-28 |
| 4847349 | Polyimide and high-temperature adhesive of polyimide from meta substituted phenoxy diamines | Masahiro Ohta, Yoshiho Sonobe, Shoji Tamai, Hideaki Oikawa, Kouji Ohkoshi +1 more | 1989-07-11 |
| 4797466 | High-temperature adhesive polyimide from 2,6-bis(3-aminophenoxy)pyridine | Hideaki Oikawa, Masahiro Ohta, Shoji Tamai, Yoshiho Sonobe, Akihiro Yamaguchi | 1989-01-10 |
| 4795798 | High-temperature adhesive polyimide from 2,2-bis[4-(3-amino phenoxy)phenyl]1,1,1,3,3,3-hexafluoro propane | Shoji Tamai, Masahiro Ohta, Hideaki Oikawa, Kouji Ohkoshi, Akihiro Yamaguchi | 1989-01-03 |