Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10392680 | Copper alloy for electric and electronic devices, copper alloy sheet for electric and electronic devices, component for electric and electronic devices, terminal, and bus bar | Hirotaka Matsunaga, Shuhei Arisawa | 2019-08-27 |
| 10294547 | Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment | Yuki Ito | 2019-05-21 |
| 10190194 | Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal | Hiroyuki Mori, Daiki Yamashita | 2019-01-29 |
| 10157694 | Copper alloy for electronic/electric device, copper alloy plastic working material for electronic/electric device, and component and terminal for electronic/electric device | Yuki Ito | 2018-12-18 |
| 10153063 | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices | Yuki Ito | 2018-12-11 |
| 10128019 | Copper alloy for electronic/electrical device, plastically-worked copper alloy material for electronic/electrical device, component for electronic/electrical device, terminal, and busbar | Hirotaka Matsunaga | 2018-11-13 |
| 10056165 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device | Yuki Ito | 2018-08-21 |
| 10032536 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device | Yuki Ito | 2018-07-24 |
| 9938606 | Hot-rolled copper plate | Hiroyuki Mori, Isao Arai, Norihisa Iida, Takahiro Takeda, Shigeru Shimoizumi +1 more | 2018-04-10 |
| 9653191 | Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal | Hiroyuki Mori, Daiki Yamashita | 2017-05-16 |
| 9587299 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment | Yuki Ito | 2017-03-07 |
| 9496064 | Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminal | Hiroyuki Mori, Daiki Yamashita | 2016-11-15 |
| 9212419 | Sputtering target for forming wiring film of flat panel display | Kenichi Yaguchi, Yosuke Nakasato, Haruhiko Asao | 2015-12-15 |
| 9066433 | Power module substrate, power module substrate with heat sink, power module, and method of manufacturing power module substrate | Yoshirou Kuromitsu, Yoshiyuki Nagatomo, Nobuyuki Terasaki, Toshio Sakamoto, Hiroyuki Mori +1 more | 2015-06-23 |
| 8951369 | Copper alloy for electronic/electric device, copper alloy thin plate for electronic/electric device, method of producing copper alloy for electronic/electric device, conductive component for electronic/electric device and terminal | Hiroyuki Mori | 2015-02-10 |
| 8658009 | Thin film transistor having a barrier layer as a constituting layer and Cu-alloy sputtering target used for sputter film formation of the barrier layer | Kenichi Yaguchi, Yosuke Nakasato, Satoru Mori | 2014-02-25 |
| 8624397 | Electrode layer structure for a thin-film transistor and process for manufacture thereof | Kenichi Yaguchi, Yosuke Nakasato | 2014-01-07 |
| 7857189 | Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance | Yuji Nakata | 2010-12-28 |
| 7678999 | Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance | Yuji Nakata | 2010-03-16 |