Issued Patents All Time
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7219909 | Front suspension device for automotive vehicle | Shigeki Furutani, Atsushi Tsuge, Naoki Ikeda, Susumu Sano, Yoshitada Toyoshima +2 more | 2007-05-22 |
| 6790711 | Method of making semiconductor device | — | 2004-09-14 |
| 6753911 | Zooming lens barrel and a camera in use therewith | Tomokazu Yamada, Yoshio Shimazaki | 2004-06-22 |
| 6650012 | Semiconductor device | — | 2003-11-18 |
| 6563209 | Lead frame for semiconductor device | — | 2003-05-13 |
| RE38043 | Lead frame | Toshiaki Shinohara | 2003-03-25 |
| 6516994 | Wire bonding apparatus for connecting semiconductor devices | — | 2003-02-11 |
| 6454158 | Wire bonding apparatus and wire bonding method of semiconductor device | — | 2002-09-24 |
| 6310395 | Electronic component with anodically bonded contact | Toshiaki Shinohara | 2001-10-30 |
| 6268647 | Electronic component with an insulating coating | Toshiaki Shinohara | 2001-07-31 |
| 6260195 | Cable television system and terminal device for cable television system | — | 2001-07-10 |
| 6245599 | Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate | Akihiro Goto, Hirochika Kawaguchi, Takao Takahashi, Takashi Arita, Satoshi Ookyuu +1 more | 2001-06-12 |
| 6181009 | Electronic component with a lead frame and insulating coating | Toshiaki Shinohara | 2001-01-30 |
| 6159766 | Designing method of leadframe tip arrangement | Hirokazu Taki, Akihiro Goto, Hirochika Kawaguchi, Yasuhito Suzuki, Takao Takahashi +2 more | 2000-12-12 |
| 6134700 | Leadframe tip arrangement designing method | Akihiro Goto, Hirokazu Taki, Yasuhito Suzuki, Takao Takahashi, Takashi Arita +1 more | 2000-10-17 |
| 6133069 | Method of manufacturing the electronic using the anode junction method | Toshiaki Shinohara | 2000-10-17 |
| 6087201 | Method of manufacturing ball grid array electronic component | Toshiaki Shinohara | 2000-07-11 |
| 6020625 | Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame | Zhi-Kang Qin, Hiroshi Kawashimo | 2000-02-01 |
| 5902119 | Leadframe tip arrangement designing method | Hirokazu Taki, Akihiro Goto, Yasuhito Suzuki, Takao Takahashi, Takashi Arita +1 more | 1999-05-11 |
| 5900671 | Electronic component including conductor connected to electrode and anodically bonded to insulating coating | Toshiaki Shinohara | 1999-05-04 |
| 5872394 | Lead frame | Toshiaki Shinohara | 1999-02-16 |
| 5793100 | Lead frame for semiconductor device | — | 1998-08-11 |
| 5786639 | Wiring member and lead frame having the same | — | 1998-07-28 |
| 5766972 | Method of making resin encapsulated semiconductor device with bump electrodes | Jiro Oseto, Teru Hirata | 1998-06-16 |
| 5768640 | Camera having an information recording function | Yoshiyuki Nojima, Yasutoshi Fujii, Noriyuki Kaedeoka, Takaichi Hayashida | 1998-06-16 |