Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5766972 | Method of making resin encapsulated semiconductor device with bump electrodes | Yoshiharu Takahashi, Jiro Oseto | 1998-06-16 |
| 5521433 | IC card including a substrate having improved strength and heat radiation properties | Shigeo Onoda, Tetsuro Washida, Yasuhiro Murasawa | 1996-05-28 |