Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6239981 | Packaging substrate | Masataka Wada | 2001-05-29 |
| 6144091 | Semiconductor device | — | 2000-11-07 |
| 6115260 | Memory module with obstacle removing terminal structure | Takao Nakajima, Tetsurou Tsuji | 2000-09-05 |
| 5949135 | Module mounted with semiconductor device | Katsunori Ochi | 1999-09-07 |
| 5889327 | Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices | Katsunori Ochi | 1999-03-30 |
| 5886874 | IC card | Shigeo Onoda, Katsunori Ochi, Yasuhiro Murasawa | 1999-03-23 |
| 5877548 | Terminal configuration in semiconductor IC device | Katsunori Ochi | 1999-03-02 |
| 5777275 | Bendable circuit board having improved resistance to bending strain and increased element mounting area | Yoshitaka Mizutani | 1998-07-07 |
| 5774339 | IC card and method of making the same | Jun Ohbuchi, Hiroshi Miura, Kiyotaka Nishino, Shigeo Onoda, Makoto Omori | 1998-06-30 |
| 5719746 | IC card | Jun Ohbuchi, Shigeo Onoda, Katsunori Ochi, Makoto Omori, Kiyotaka Nishino | 1998-02-17 |
| 5671123 | IC card with a discharge pattern and a ground pattern separated from each other | Makoto Omori, Katsunori Ochi, Jun Ohbuchi | 1997-09-23 |
| 5585617 | Non-contact IC card communicating at multiple frequencies | Jun Ohbuchi, Shigeru Furuta | 1996-12-17 |
| 5583748 | Semiconductor module having multiple circuit boards | Hidenobu Gochi | 1996-12-10 |
| 5521433 | IC card including a substrate having improved strength and heat radiation properties | Teru Hirata, Shigeo Onoda, Yasuhiro Murasawa | 1996-05-28 |
| 5521786 | Semiconductor module and IC package used for the semiconductor module | Hidenobu Gochi | 1996-05-28 |