Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6245599 | Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate | Akihiro Goto, Yoshiharu Takahashi, Takao Takahashi, Takashi Arita, Satoshi Ookyuu +1 more | 2001-06-12 |
| 6159766 | Designing method of leadframe tip arrangement | Hirokazu Taki, Akihiro Goto, Yoshiharu Takahashi, Yasuhito Suzuki, Takao Takahashi +2 more | 2000-12-12 |