Issued Patents All Time
Showing 76–100 of 216 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7190616 | In-service reconfigurable DRAM and flash memory device | Leonard Forbes | 2007-03-13 |
| 7190043 | Techniques to create low K ILD for beol | Arup Bhattacharyya | 2007-03-13 |
| 7186664 | Methods and structures for metal interconnections in integrated circuits | Kie Y. Ahn, Leonard Forbes | 2007-03-06 |
| 7172949 | Epitaxial semiconductor layer and method | — | 2007-02-06 |
| 7164188 | Buried conductor patterns formed by surface transformation of empty spaces in solid state materials | Joseph E. Geusic | 2007-01-16 |
| 7161246 | Interconnect alloys and methods and apparatus using same | — | 2007-01-09 |
| 7158399 | Digital data apparatuses and digital data operational methods | — | 2007-01-02 |
| 7157387 | Techniques to create low K ILD for BEOL | Arup Bhattacharyya | 2007-01-02 |
| 7132348 | Low k interconnect dielectric using surface transformation | Joseph E. Geusic, Arup Bhattacharyya | 2006-11-07 |
| 7121919 | Chemical mechanical polishing system and process | — | 2006-10-17 |
| 7105841 | Photolithographic techniques for producing angled lines | — | 2006-09-12 |
| 7105914 | Integrated circuit and seed layers | — | 2006-09-12 |
| 7094682 | Coating of copper and silver air bridge structures to improve electromigration resistance and other applications | — | 2006-08-22 |
| 7084413 | Photolithographic techniques for producing angled lines | — | 2006-08-01 |
| 7075166 | Coating of copper and silver air bridge structures to improve electromigration resistance and other applications | — | 2006-07-11 |
| 7064007 | Method of using foamed insulators in three dimensional multichip structures | — | 2006-06-20 |
| 7057289 | Etch stop in damascene interconnect structure and method of making | — | 2006-06-06 |
| 7052987 | Method for fabricating a low capacitance wiring layout | — | 2006-05-30 |
| 7049219 | Coating of copper and silver air bridge structures to improve electromigration resistance and other applications | — | 2006-05-23 |
| 7028879 | System for depositing connection sites on micro C-4 semiconductor die | Jerome M. Eldridge | 2006-04-18 |
| 6998711 | Method of forming a micro solder ball for use in C4 bonding process | — | 2006-02-14 |
| 6984544 | Die to die connection method and assemblies and packages including dice so connected | Eugene H. Cloud | 2006-01-10 |
| 6979848 | Memory system with conductive structures embedded in foamed insulator | — | 2005-12-27 |
| 6975027 | Multi-chip electronic package and cooling system | Jerome M. Eldridge | 2005-12-13 |
| 6958287 | Micro C-4 semiconductor die | Jerome M. Eldridge | 2005-10-25 |