Issued Patents All Time
Showing 26–49 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7052957 | Methods of fabricating double-sided hemispherical silicon grain electrodes and capacitor modules | — | 2006-05-30 |
| 6943078 | Method and structure for reducing leakage current in capacitors | Er-Xuan Ping | 2005-09-13 |
| 6927170 | Methods for making semiconductor device structures with capacitor containers and contact apertures having increased aspect ratios | — | 2005-08-09 |
| 6890818 | Methods of forming semiconductor capacitors and memory devices | Er-Xuan Ping | 2005-05-10 |
| 6888186 | Reduction of damage in semiconductor container capacitors | Er-Xuan Ping | 2005-05-03 |
| 6881682 | Method and structure for reducing leakage current in capacitors | Er-Xuan Ping | 2005-04-19 |
| 6835674 | Methods for treating pluralities of discrete semiconductor substrates | Trung T. Doan, Lyle Breiner, Er-Xuan Ping | 2004-12-28 |
| 6831319 | Cell nitride nucleation on insulative layers and reduced corner leakage of container capacitors | — | 2004-12-14 |
| 6825081 | Cell nitride nucleation on insulative layers and reduced corner leakage of container capacitors | — | 2004-11-30 |
| 6812150 | Methods for making semiconductor device structures with capacitor containers and contact apertures having increased aspect ratios | — | 2004-11-02 |
| 6803621 | Oxygen barrier for cell container process | Sam Yang | 2004-10-12 |
| 6794245 | Methods of fabricating double-sided hemispherical silicon grain electrodes and capacitor modules | — | 2004-09-21 |
| 6791113 | Capacitor constructions comprising a nitrogen-containing layer over a rugged polysilicon layer | Behnam Moradi, Er-Xuan Ping, John Packard | 2004-09-14 |
| 6746930 | Oxygen barrier for cell container process | Sam Yang | 2004-06-08 |
| 6704188 | Ultra thin TCS (SiCL4) cell nitride for dram capacitor with DCS (SiH2Cl2) interface seeding layer | Er-Xuan Ping | 2004-03-09 |
| 6696715 | Method and structure for reducing leakage current in capacitors | Er-Xuan Ping | 2004-02-24 |
| 6653199 | Method of forming inside rough and outside smooth HSG electrodes and capacitor structure | — | 2003-11-25 |
| 6613628 | Method and structure for reducing leakage current in capacitors | Er-Xuan Ping | 2003-09-02 |
| 6607965 | Methods of forming capacitors | Behnam Moradi, Er-Xuan Ping, John Packard | 2003-08-19 |
| 6583441 | Capacitor constructions comprising a nitrogen-containing layer over a rugged polysilicon layer | Behnam Moradi, Er-Xuan Ping, John Packard | 2003-06-24 |
| 6562684 | Methods of forming dielectric materials | Behnam Moradi, Er-Xuan Ping, John Packard | 2003-05-13 |
| 6551893 | Atomic layer deposition of capacitor dielectric | Er-Xuan Ping, Lyle Breiner, Trung T. Doan | 2003-04-22 |
| 6538274 | Reduction of damage in semiconductor container capacitors | Er-Xuan Ping | 2003-03-25 |
| 6465373 | Ultra thin TCS (SiCl4) cell nitride for DRAM capacitor with DCS (SiH2Cl2) interface seeding layer | Er-Xuan Ping | 2002-10-15 |