Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331137 | Metal-insulator-metal capacitors between metal interconnect layers | Peter Smeys, Shuxian Chen, Girish Venkitachalam | 2016-05-03 |
| 8912104 | Method for fabricating integrated circuits with patterned thermal adjustment layers for design optimization | Christopher J. Pass, Che Ta Hsu, Fangyun Richter, Wilson Wong | 2014-12-16 |
| 6849544 | Forming a conductive structure in a semiconductor device | Ronald A. Weimer, Yongjun Jeff Hu, Pai-Hung Pan, James A. Beck, Randhir P. S. Thakur | 2005-02-01 |
| 6596595 | Forming a conductive structure in a semiconductor device | Ronald A. Weimer, Yongjun Jeff Hu, Pai-Hung Pan, James A. Beck, Randhir P. S. Thakur | 2003-07-22 |
| 6362086 | Forming a conductive structure in a semiconductor device | Ronald A. Weimer, Yongjun Jeff Hu, Pai-Hung Pan, James A. Beck, Randhir P. S. Thakur | 2002-03-26 |
| 6291868 | Forming a conductive structure in a semiconductor device | Ronald A. Weimer, Yongjun Jeff Hu, Pai-Hung Pan, James A. Beck, Randhir P. S. Thakur | 2001-09-18 |