SL

Shih-Hsiung Lin

ME Megica: 19 patents #7 of 32Top 25%
AO Au Optronics: 5 patents #634 of 2,945Top 25%
AU Auo: 1 patents #111 of 312Top 40%
IT ITRI: 1 patents #5,197 of 9,619Top 55%
NC National Science Council: 1 patents #238 of 867Top 30%
QU Qualcomm: 1 patents #7,512 of 12,104Top 65%
Overall (All Time): #135,640 of 4,157,543Top 4%
28
Patents All Time

Issued Patents All Time

Showing 26–28 of 28 patents

Patent #TitleCo-InventorsDate
6784087 Method of fabricating cylindrical bonding structure Jin-Yuan Lee, Chien-Kang Chou, Hsi-Shan Kuo 2004-08-31
6207475 Method for dispensing underfill and devices formed Hsing-Seng Wang 2001-03-27
5741382 Method for preparing oriented discontinuous long fiber reinforced thermoplastic resin composite sheet product Chen-Chi Martin Ma 1998-04-21